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Infineon Adds 400-MHz Option to AURIX TC3x Automotive MCUs The new 400 MHz variants increase real-time processing headroom for automotive control and ADAS systems.

Infineon Adds 400-MHz Option to AURIX TC3x Automotive MCUs

The new 400 MHz variants increase real-time processing headroom for automotive control and ADAS systems.

IAR Adds Long-Term Support Services to Development Platform IAR Systems has expanded its embedded development platform with long-term support (LTS) services to maintain stable and reproducible toolchains for safety-critical applications over extended product lifecycles. The new offering addresses requirements common in sectors such as automotive, industrial automation, and medical technology, where embedded software environments must remain consistent for many years after products enter production. In safety-critical development, maintaining long-term continuity of compilers, libraries, and build environments is essential.

IAR Adds Long-Term Support Services to Development Platform

IAR Systems has expanded its embedded development platform with long-term support (LTS) services to maintain stable and reproducible toolchains for safety-critical applications over extended product lifecycles. The new offering addresses…

AMD Powers SolidRun’s COM Express Type 6 Modules

COM Express Type 6 modules target rugged edge AI systems in mission-critical environments.

ST Delivers AI-Enhanced Motor Control Software STMicroelectronics has introduced motor-control software that simplifies enhancing industrial drives with AI for optimization and predictive maintenance. Supporting the EVLSPIN32G4-ACT evaluation board, the FP-IND-MCAI1 function pack helps designers implement smart capabilities in industrial drives and servos, home appliances, robotics, and a variety of actuators. The AI-enhanced software includes a sample application to drive a low-voltage three-phase brushless motor with field-oriented control (FOC), HAL, and board-specific drivers, as well as a machine-learning (ML) solution for motor behavior classification.

ST Delivers AI-Enhanced Motor Control Software

STMicroelectronics has introduced motor-control software that simplifies enhancing industrial drives with AI for optimization and predictive maintenance. Supporting the EVLSPIN32G4-ACT evaluation board, the FP-IND-MCAI1 function pack helps designers…

Nordic Adds Entry-Level Bluetooth LE SoCs

These BLE SoCs can function as the main wireless SoC or operate as BLE companion devices.

Enhanced Security with CHERI, ESD March issue: Embedded Week Insights

Here’s a roundup of this week’s must-read articles. We'll look into the latest developments on embedded systems and smart factories in the ESD March digital magazine, enhanced security with CHERI, and an expanded Renesas-GF…

Digi Acquires Particle to Extend Embedded IoT Reach Acquisition expands Digi’s embedded-as-a-service IoT portfolio, enabling customers to build IoT solutions faster.

Digi Acquires Particle to Extend Embedded IoT Reach

Acquisition expands Digi’s embedded-as-a-service IoT portfolio, enabling customers to build IoT solutions faster.

Marvell Unveils 1.6T ZR/ZR+ Pluggable and 2-nm Coherent DSPs

Marvell Technology, Inc. has expanded its coherent optical networking portfolio with new ZR/ZR+ data center interconnect (DCI) solutions, including a 1.6 Tb/s pluggable module and coherent digital signal processors (DSPs) manufactured on…

Grinn, Renesas Launch SOM for Edge AI Vision Systems Grinn has announced a collaboration with Renesas Electronics to introduce the Grinn ReneSOM-V2H, a production-ready system-on-module (SOM) designed to accelerate the development of AI- and vision-based edge devices. The module is built around the Renesas RZ/V2H processor and is designed to reduce hardware development complexity and shorten time to market. The ReneSOM-V2H integrates the RZ/V2H, which combines four Arm Cortex-A55 cores for application processing, two Cortex-R8 cores for real-time control, and a Cortex-M33 core for low-power and supervisory tasks.

Grinn, Renesas Launch SOM for Edge AI Vision Systems

Grinn has announced a collaboration with Renesas Electronics to introduce the Grinn ReneSOM-V2H, a production-ready system-on-module (SOM) designed to accelerate the development of AI- and vision-based edge devices. The module is built around…

ARIA Sensing, Algorized Unveil AI-Enabled UWB Radar Platform

ARIA Sensing and Algorized have announced a strategic collaboration to advance ultra-wideband (UWB) sensing by combining a 3D UWB radar system-on-chip (SoC) with an embedded edge AI software platform. The joint solution debuts with an…

Embedded Systems Are Pivotal to Smart Factories Embedded systems are central to the next evolution of smart factories.

Embedded Systems Are Pivotal to Smart Factories

Embedded systems are central to the next evolution of smart factories.

A CHERI on Top: A Better Way to Build Embedded Secure SoCs

Hardware-enforced memory safety strengthens security, simplifies functional safety and even reduces firmware size.

Nordic Semiconductor Expands Cellular IoT Portfolio Nordic Semiconductor has announced a significant expansion of its ultra-low-power cellular IoT portfolio at MWC 2026. The update includes two new product families, the nRF92 and nRF93 Series, along with enhancements to the established nRF91 Series. The new devices address evolving LTE-M, NB-IoT, Cat 1 bis, satellite NTN, and future 5G eRedCap requirements. The nRF92 Series is designed as a highly integrated and power-efficient cellular solution.

Nordic Semiconductor Expands Cellular IoT Portfolio

Nordic Semiconductor has announced a significant expansion of its ultra-low-power cellular IoT portfolio at MWC 2026. The update includes two new product families, the nRF92 and nRF93 Series, along with enhancements to the established nRF91…

Renesas, GF Partner to Strengthen Supply Chain Japanese chipmaker Renesas Electronics Corporation and U.S.-based semiconductor manufacturer Global Foundries (GF) have entered into a multi-billion dollar manufacturing agreement. Under this partnership, Renesas will harness key GF manufacturing technologies to make system-on-chips (SoCs), power devices, and microcontrollers (MCUs) at GF fabs in the U.S. and other countries for automotive and industrial systems. Producing semiconductors for automotive applications is the focal point of this partnership.

Renesas, GF Partner to Strengthen Supply Chain

Japanese chipmaker Renesas Electronics Corporation and U.S.-based semiconductor manufacturer Global Foundries (GF) have entered into a multi-billion dollar manufacturing agreement. Under this partnership, Renesas will harness key GF manufacturing…

UFS 5.0 Flash Memory Devices, MIPI Spec Upgrades: Embedded Week Insights

Here’s a roundup of this week’s must-read articles. We'll look into the latest developments on UFS 5.0 Flash memory devices, a new presence detection solution, an agentic AI toolkit for chip verification, and the MIPI…

Siemens Agentic Toolkit Automates Chip Verification Workflows

Industry is converging on a future where chip design and verification are heavily assisted by AI orchestration.

Linaro, Arm Launch CoreCollective Open Consortium Linaro Ltd. has launched CoreCollective, a new industry consortium designed to advance open collaboration across the Arm software ecosystem. Backed by Arm, membership is free and open to any company involved in building, testing, or deploying workloads on Arm. CoreCollective is hosted by Linaro, which provides organizational and engineering leadership, and receives financial backing from Arm. The consortium builds on over 15 years of Linaro's work accelerating Arm-based solutions, spanning Linux, firmware, security, cloud, edge computing, IoT, AI, automotive, virtualization, toolchains, and major platforms, including Windows on Arm and Android.

Linaro, Arm Launch CoreCollective Open Consortium

Linaro Ltd. has launched CoreCollective, a new industry consortium designed to advance open collaboration across the Arm software ecosystem. Backed by Arm, membership is free and open to any company involved in building, testing, or deploying…

Kioxia Samples UFS 5.0 Flash Memory Devices Kioxia America, Inc. has started shipping test samples of embedded flash memory designed to comply with the UFS 5.0 standard, which is under development by JEDEC. UFS 5.0 is engineered to meet the demanding performance needs of next-generation mobile devices, including smartphones with on-device AI capabilities. Leveraging MIPI M-PHY version 6.0 for its physical layer and UniPro version 3.0 for its protocol, UFS 5.0 introduces HS-GEAR6 mode, enabling interface speeds of up to 46.6 Gbits/s per lane.

Kioxia Samples UFS 5.0 Flash Memory Devices

Kioxia America, Inc. has started shipping test samples of embedded flash memory designed to comply with the UFS 5.0 standard, which is under development by JEDEC. UFS 5.0 is engineered to meet the demanding performance needs of next-generation mobile…

MIPI Alliance Upgrades Specs for JEDEC UFS The MIPI Alliance has released two major updates to its UniPro and M-PHY specifications, targeting JEDEC Universal Flash Storage (UFS 5.0) for edge AI in mobile, PC, and automotive applications. The new MIPI UniPro v3.0 and MIPI M-PHY v6.0 versions offer performance, latency, and power-efficiency improvements for JEDEC UFS 5.0 solutions to support edge AI workloads in smartphones, tablets, PCs, gaming consoles, automotive, and industrial applications.

MIPI Alliance Upgrades Specs for JEDEC UFS

The MIPI Alliance has released two major updates to its UniPro and M-PHY specifications, targeting JEDEC Universal Flash Storage (UFS 5.0) for edge AI in mobile, PC, and automotive applications. The new MIPI UniPro v3.0 and MIPI M-PHY v6.0 versions offer…

Socionext, Innatera Develop Presence Detection Solution Socionext and Innatera have jointly developed a human-presence detection system that integrates 60-GHz FMCW radar sensing with neuromorphic edge AI, providing consistent, reliable detection while significantly reducing power consumption. This technology will be demonstrated live at Embedded World 2026 in Nuremberg (Booth 4A-628). The system combines Socionext’s compact 60-GHz FMCW radar, which acquires detailed three-dimensional environmental data regardless of lighting or weather conditions, with Innatera’s ultra-low-power…

Socionext, Innatera Develop Presence Detection Solution

Socionext and Innatera have jointly developed a human-presence detection system that integrates 60-GHz FMCW radar sensing with neuromorphic edge AI, providing consistent, reliable detection while significantly reducing power consumption. This…

SPAD Imaging, Renesas 3nm TCAM Technology, LoRa Alliance 2025 Report: Embedded Week Insights

Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on SPAD Imaging, Renesas 3nm TCAM Technology, and LoRa Alliance 2025 Report!

MIKROE Introduces EnOcean 5 Click Board The EnOcean 5 Click, a new wireless connectivity Click board™ developed by MIKROE, provides a two-way communication interface for sensors, switches, and actuators based on the EnOcean protocol. These compact Click expansion boards allow developers to quickly create proof-of-concept designs, prototype, and program new embedded applications. The new board is built around the TCM 615 radio transceiver gateway module from…

MIKROE Introduces EnOcean 5 Click Board

The EnOcean 5 Click, a new wireless connectivity Click board™ developed by MIKROE, provides a two-way communication interface for sensors, switches, and actuators based on the EnOcean protocol. These compact Click expansion boards allow developers to quickly…

Renesas Demonstrates Configurable 3nm TCAM Renesas Electronics Corporation has announced the development of a configurable ternary content-addressable memory (TCAM) implemented using a 3 nm FinFET manufacturing process. The new design combines increased storage density, reduced power consumption, and enhanced functional safety, positioning it for use in automotive environments. The company presented its results at the International Solid-State Circuits Conference 2026, held February 15–19 in San Francisco, California.

Renesas Demonstrates Configurable 3nm TCAM

Renesas Electronics Corporation has announced the development of a configurable ternary content-addressable memory (TCAM) implemented using a 3 nm FinFET manufacturing process. The new design combines increased storage density, reduced power consumption,…

Renesas Advances 3 nm Automotive SoC Technologies New platform integrates AI acceleration, chiplet safety, and advanced power management for software-defined vehicle architectures.

Renesas Advances 3 nm Automotive SoC Technologies

New platform integrates AI acceleration, chiplet safety, and advanced power management for software-defined vehicle architectures.

LoRa Alliance 2025 Report Highlights LoRaWAN Growth

The LoRa Alliance®, the international organization responsible for the open LoRaWAN® standard for low-power wide-area networks (LPWANs), has published its 2025 End of Year Report. This report shows an important year when LoRaWAN moved from being…

Microchip, Hyundai Partner on 10BASE-T1S SPE Microchip Technology has announced a partnership with Hyundai Motor Group (HMG) to investigate the implementation of advanced in-vehicle network solutions utilizing 10BASE-T1S Single-Pair Ethernet (SPE) technology. This joint initiative aims to facilitate the creation of vehicle architectures that are more efficient, reliable, and scalable, addressing the changing requirements of future mobility. The fast-paced progress in advanced driver-assistance systems (ADAS) and connected vehicle functionalities is increasing the demand for high-performance in-vehicle networking.

Microchip and Hyundai Motor Group partner to advance 10BASE-T1S #SPE in next-generation #automotive architectures. #singlepairethernet

Laser driver ICs cut power losses by 70% Silanna Semiconductor’s FirePower laser driver ICs, introduced in 2025, for LiDAR and rangefinder applications are now available in production quantities. The SL2001 and SL2002 laser firing system ICs, housed in a 14-pin 3.5-mm2 package, integrate charging and firing on a single chip, reducing power losses by 70% and footprint by 80%. Developed to reduce power consumption, system size, design complexity, and bill-of-material costs compared to other laser driver technologies, Silanna claims the SL2001 and SL2002 are the first laser firing system ICs to combine resonant capacitor charging and high-current laser diode firing on a single device, which eliminates multiple external discrete components and inefficient conversion phases.

Silanna’s SL2001 and SL2002 laser driver ICs for #LiDAR and #rangefinders are now available in production quantities, along with #evaluationkits. #laserdrivers

Agentic AI Chip Design, Networking Chip, Edge AI: Embedded Week Insights Here’s a roundup of this week’s must-read articles. We look into the latest developments on Cadence Agentic AI, Cisco’s Silicon One G300 Switch, Microchip's full-stack edge AI solutions, and more. Also, check News Archives – Embedded and Technical Articles Archives – Embedded for the complete list of news and articles from our website. NEWS Cisco Unveils Silicon One G300 AI Networking Chip…

This week’s roundup of news covers a range of topics from Cadence’s #AgenticAI chip design to Microchip's full-stack #edgeAI solutions. #EmbeddedWeekInsights

#SPAD #sensors are an alternative #imaging solution for #embedded #industrial #robotics systems thanks to their photon-level imaging.

Tasking Announces Integrated Embedded Software Toolchain On the first anniversary of its acquisition of LDRA, Tasking has announced the availability of its integrated toolchain. Following the successful unification of LDRA and Tasking technologies, the combined solution delivers end-to-end capabilities combining compilation, debugging, and testing within a single development environment. AI-assisted features further support the accelerated development of functionally safe and secure real-time embedded systems targeting automotive, aerospace and defense, industrial automation, and robotics applications.

Tasking unveils integrated compile, #debug, and #test #toolchain for safety- and security critical #embedded systems in #automotive, #industrial, and #robotics.