=>
Huawei
"Semiconductor Packaging Structure, Manufacturing Method and Electronic Device", (CN: Mar 2024) patents.google.com/patent/WO202...
Comm Chip & Data Switching (CN: Jul 2022) bsky.app/profile/ogaw...
4x4 (12 NPs)/5x5 (16 NPs)
Researcher - Wafer-Scale Sys careers.huaweirc.ch/jobs/7188421...
12.03.2026 08:21
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Can’t make it to ZKM but near Seattle?Join us at icm.museum to celebrate 40 years of the connection machine!
#ai #supercomputing #hpc #lisp
12.03.2026 01:52
👍 8
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"Four MTIA Chips in Two Years: Scaling AI Experiences for Billions", Mar 11, 2026 ai.meta.com/blog/meta-mt...
MTIA 300: A Cost-Effective Foundation
MTIA 400: Competitive Raw Performance
MTIA 450: A Leap Forward ...
MTIA 500
KernelEvolve, arXiv, Jan 16 bsky.app/profile/ogaw...
MTIA v2i, ISCA 2025
12.03.2026 02:14
👍 1
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GF at the Forefront of the Photonics & Packaging Revolution, GF business webinar series, Mar 10, 2026
Webcast edge.media-server.com/mmc/p/y3h58h...
investors.gf.com/static-files...
Why GF Wins In Silicon Photonics
Complete CPO Development Under One Roof
Review, Jan 1 bsky.app/profile/ogaw...
11.03.2026 11:28
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"Network Design for Wafer-Scale Systems with Wafer-on-Wafer Hybrid Bonding", Patrick Iff, ..., Luca Benini, Torsten Hoefler, ETH Zurich, arXiv, Mar 5, 2026 arxiv.org/abs/2603.05266
2D Mesh-like base + Four Reticle placements
ACM CF 2025 bsky.app/profile/ogaw...
scholar.google.com/citations?hl...
10.03.2026 10:52
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=>
Ubitium Tapes Out Universal Processor, Mar 9, 2026 www.ubitium.com/ubitium-tape...
completed in Dec 2025, Samsung 8nm
markets.businessinsider.com/news/stocks/...
drive.google.com/file/d/1omnl...
Universal #RISCV Processor
Reconfigurable at Runtime
(May 2025) patents.google.com/patent/WO202...
10.03.2026 03:54
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=>
"Advances in waveguide to waveguide couplers for 3D integrated photonic packaging", Review, Light: science & applications, Jan 1, 2026 www.nature.com/articles/s41...
49 pp, 382 ref
CPO: Heterogeneous Integration of Chiplets, Dec 15, 2025 bsky.app/profile/ogaw...
CPO Book, SemiAnalysis, Jan 2
09.03.2026 14:43
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"Please, No More Loops (Than Necessary): New Patterns in Fortran 2023", Damian Rouson, LBNL, HPC Best Practices Webinar, Jan 21, 2026 www.youtube.com/watch?v=DKV2...
ideas-productivity.org/assets/artif...
QA ideas-productivity.org/assets/artif...
Fortran 2023, LBNL, Mar 2025 x.com/ogawa_tter/s...
08.03.2026 12:26
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"AI Compute: The Dataflow Way", Kunle Olukotun, Stanford & Chief Technologist, SambaNova, NSF WS on AI+HW 2035, Oct 16, 2025 publish.illinois.edu/ai-hw-worksh...
Plasticine x.com/ogawa_tter/s...
Streaming Tensor Programs, ASPLOS 2026 arxiv.org/abs/2511.07776
SN50, Feb 24 bsky.app/profile/ogaw...
08.03.2026 07:32
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=>
🇨🇳 面向下一代硬件的算子编程必修课
Next-gen Huawei Ascend (950: SIMD/SIMT)
Ascend C算子编译与调试调优能力概述、2026年3月6日
www.bilibili.com/video/BV15AP...
raw.gitcode.com/cann/communi...
基于下一代硬件的Cube编程 (Next-gen Ascend Cube (Matrix Engine)、3月5日 bsky.app/profile/ogaw...
C Reg矢量编程、3月4日
SIMT编程介绍、3月3日
C算子编程概述、3月2日
07.03.2026 02:59
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The RSECon26 Call for Submissions is open! Share the tools you build and the RSE practices you are advancing. We welcome talks, workshops, and posters from all domains. Check the guidelines and submit your proposals today! Link: rsecon26.society-rse.org/calls/submis... #RSECon26
06.03.2026 08:00
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"FlashAttention-4: Algorithm and Kernel Pipelining Co-Design for Asymmetric Hardware Scaling", Ted Zadouri, ..., Tri Dao, arXiv, Mar 5, 2026 arxiv.org/abs/2603.05451
www.together.ai/blog/flashat...
"How FlashAttention 4 Works", Modal, Oct 1, 2025 bsky.app/profile/ogaw...
FA3, NeurIPS 2024
06.03.2026 11:22
👍 0
🔁 0
💬 1
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=>
🇨🇳 面向下一代硬件的算子编程必修课
Next-gen Huawei Ascend (950: SIMD/SIMT)
2026年3月4/3/2日 bsky.app/profile/ogaw...
Next-gen Cube (Matrix Engine)、3月5日
www.bilibili.com/video/BV118P...
raw.gitcode.com/cann/communi...
New: HiF8 & MXFP8, MXFP4
FP32?
SGEMM-cube: FP32 GEMM Using FP16 Cube, PCL bsky.app/profile/ogaw...
06.03.2026 02:50
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📌 1
=>
NVIDIA’s Next-Gen Feynman GPUs Could See the Inclusion of Groq’s LPU Units By 2028, Dec 28, 2025 wccftech.com/nvidia-feynm...
🤔🤔🤔
3D Chip & Package, NVIDIA, (Sep 2024) bsky.app/profile/ogaw...
Groq, Appls x.com/ogawa_tter/s...
I. Arsovski, Feb 2024
Dec 24, 2025 bsky.app/profile/ogaw...
D. Abts
05.03.2026 15:09
👍 0
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💬 1
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=>
🇨🇳 面向下一代硬件的算子编程必修课
Next-gen Huawei Ascend (950: SIMD/SIMT)
C Reg矢量编程、2026年3月4日
www.bilibili.com/video/BV1uPP...
raw.gitcode.com/cann/communi...
SIMT编程介绍、3月3日
www.bilibili.com/video/BV1zNP...
raw.gitcode.com/cann/communi...
C算子编程概述、3月2日 bsky.app/profile/ogaw...
New raw.gitcode.com/cann/communi...
05.03.2026 11:40
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=>
CRAY-1: American Innovation $1 Coin 2026, Wisconsin www.usmint.gov/american-inn...
US Mint, Oct 15, 2025 bsky.app/profile/ogaw...
Seymour Cray at 100, Sep 28, 2025
CRAY-1 at LASL: an update, May 1977 www.osti.gov/biblio/7210319
SN1 cray-history.net/2021/07/28/s...
1976年3月4日 x.com/DesignSpark_...
05.03.2026 03:01
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💬 1
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=>
"Why (and how) matrix processing?", José MoreiraI, IBM Research, NHR PerfLab Seminar, Dec 9, 2025 www.youtube.com/watch?v=mTUj...
hpc.fau.de/files/2025/1...
scholar.google.com/citations?us...
Power11, Jul 24, 2025 bsky.app/profile/ogaw...
Redbooks, Oct/Sep 2025
MMA, Power10 x.com/ogawa_tter/s...
04.03.2026 14:58
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=>
Fiber for AI WS, Feb, 24, 2026 [2/2]
Multicore and Hollow-Core Fiber (MCF and HCF)
Lightera www.ieee802.org/3/ad_hoc/E4A...
lightera.com
Huawei
www.ieee802.org/3/ad_hoc/E4A...
www.ieee802.org/3/ad_hoc/E4A...
Peng Cheng Lab bsky.app/profile/ogaw...
[1/2] bsky.app/profile/ogaw...
Panduit
Corning
04.03.2026 14:05
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=>
Fiber for AI WS, Feb, 24, 2026 [1/2]
Multicore and Hollow-Core Fiber (MCF and HCF)
Panduit www.ieee802.org/3/ad_hoc/E4A...
Corning www.ieee802.org/3/ad_hoc/E4A...
MS Azure with Corning & Heraeus, Sep 2025 bsky.app/profile/ogaw...
Webinar, Jun 10
IEC-ITU-T WS, Oct 17 bsky.app/profile/ogaw...
=>
04.03.2026 13:53
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"省エネエレクトロニクスの製造基盤強化に向けた技術開発事業/パワーエレクトロニクス関連動向調査"、2025年度成果報告書、株式会社三菱総合研究所、公開:2026年2月27日、NEDO
226枚
NEDO 成果報告書データベース seika.nedo.go.jp/pmg/PMG01C/P...
から検索 (ダウンロードには要ユーザー登録、無料)
04.03.2026 08:23
👍 0
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💬 1
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🇨🇳 基于下一代 Huawei Ascend平台的 Ascend C算子编程概述、2026年3月2日
(43 pp) raw.gitcode.com/cann/communi...
<= Live (1:06:59) bsky.app/profile/ogaw...
HiFloat4, Feb 13
Huawei Connect 2025, Sep 18
Ascend 910C (25/Q1): SIMD
FP32/HF32/FP16/BF16/INT8
Ascend 950PR (26/Q1) / 950DT (26/Q4): SIMD/SIMT
+ FP8/MXFP8/HiF8/MXFP4
04.03.2026 06:27
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=>
🇨🇳 An Overview of Huawei Ascend C Operator Programming based on the Next-Gen Ascend Platform, Mar 3, 2026, 昇腾CANN (1:06:59) www.bilibili.com/video/BV12fA...
HiFloat4, arXiv, Feb 13, 2026 bsky.app/profile/ogaw...
M²XFP, ASPLOS 2026
Appl (CN: Feb 2023) bsky.app/profile/ogaw...
HC 2025
950 SIMD/SIMT
03.03.2026 14:50
👍 0
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