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SemiEngineering's latest Low Power-High Performance newsletter
semiengineering.com/newsletter/l...

#NPUs #datacenters #GDDR7 #clockjitter
#MIPI #PCIe #semiconductor

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An FPGA FMC 4x MIPI CSI camera breakout adapter Gaurav Singh posts about making an FPGA FMC Connector LPC breakout carrier/adapter board to connect 4 MIPI Cameras to Xilinx Ultrascale+ FPGAs. The b...

#cameras #fpga #PCB #Raspberry #Pi #camera #CSI #MIPI […]

[Original post on blog.adafruit.com]

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Olimex LT8912B-based MIPI-HDMI adapter board adds HDMI output to the ESP32-P4-Devkit board Olimex MIPI-HDMI adapter board is built around Lontium Semiconductors’ LT8912B MIPI DSI to HDMI bridge chip designed to work with their own ESP32-P4-DevKit. The board outputs up to 1080p60 8-bit HDMI via its LT8912B converter and supports 1–4 MIPI DSI data lanes (80 Mbps to 1.5 Gbps per lane) in continuous-clock mode, outputting HDMI 1.4 video in a compact 60 × 24 mm form factor. These features make it suitable for UI rendering, video streaming, media playback, vision workflows, and HMI applications like digital signage, kiosk systems, and portable multimedia devices. Olimex MIPI-HDMI adapter specifications: Mail Chip – LT8912B Single-Channel MIPI DSI Bridge to LVDS/HDMI/MHL converter MIPI Interface 15-pin FPC connector 1 clock lane + 1 to 4 data lanes D-PHY 1.1 and DSI 1.02 compliant 80 Mbps to 1.5 Gbps per lane supported data rate Continuous-clock mode only HDMI output HDMI Type-A connector HDMI 1.4 transmitter Up to 1080p [...] The post Olimex LT8912B-based MIPI-HDMI adapter board adds HDMI output to the ESP32-P4-Devkit board appeared first on CNX Software - Embedded Systems News.
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Video Pipeline Recommendations

General advice on which technology to use when doing real time image processing. It depends strongly on what bandwidth you need, and what you want to accomplish.

#FPGA #ImageSensor #RaspberryPi #MIPI #Lattice #USB

https://wiki.pythonlinks.info/recommendations

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Sony IMX477 Image Sensor

This is the sensor used in the #RaspberryPi 12MegaPixel #Camera.

The only reason that it can push that much bandwidth through the MIPI-CSI connector, is because it does not do #debayering. It only publishes the raw data. That takes […]

[Original post on mastodon.social]

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MIPI SoundWire I3S (SWI3S) targets high-bandwidth, low-latency audio applications The MIPI Alliance has recently released the SoundWire I3S (MIPI SWI3S v1.0) specification for high-bandwidth, low-latency audio applications which unify control and data over a single, power-efficient interface. SWI3S builds upon the two-pin, multi-drop architecture of MIPI SoundWire released in 2014, and offers higher bandwidth, low power consumption, much better noise immunity, and support for scalable multi-device topologies to meet the increasing requirements of embedded audio systems. MIPI SWI3S v1.0 supports data rates up to 76 Mbps against 24 Mbps for the earlier SLIMbus and SoundWire audio interfaces, and improves noise immunity by operating in “forwarded clock” or “differential low voltage signaling”. It also implements a range of new features such as Hubs, multiple PHY support, control CRC, power-saving techniques, and more. MIPI SoundWire I3S key features: Transports audio data, control commands, interrupt signals, and synchronization information over a unified two-pin link Forwarded bit clock single-ended (FBCSE) and differential low-voltage [...] The post MIPI SoundWire I3S (SWI3S) targets high-bandwidth, low-latency audio applications appeared first on CNX Software - Embedded Systems News.
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MIPI SoundWire I3S (SWI3S) targets high-bandwidth, low-latency audio applications The MIPI Alliance has recently released the SoundWire I3S (MIPI SWI3S v1.0) specification for high-bandwidth, low-latency audio applications which unify control and data over a single, power-efficient interface. SWI3S builds upon the two-pin, multi-drop architecture of MIPI SoundWire released in 2014, and offers higher bandwidth, low power consumption, much better noise immunity, and support for scalable multi-device topologies to meet the increasing requirements of embedded audio systems. MIPI SWI3S v1.0 supports data rates up to 76 Mbps against 24 Mbps for the earlier SLIMbus and SoundWire audio interfaces, and improves noise immunity by operating in “forwarded clock” or “differential low voltage signaling”. It also implements a range of new features such as Hubs, multiple PHY support, control CRC, power-saving techniques, and more. MIPI SoundWire I3S key features: Transports audio data, control commands, interrupt signals, and synchronization information over a unified two-pin link Forwarded bit clock single-ended (FBCSE) and differential low-voltage [...] The post MIPI SoundWire I3S (SWI3S) targets high-bandwidth, low-latency audio applications appeared first on CNX Software - Embedded Systems News.
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MIPI SoundWire I3S (SWI3S) targets high-bandwidth, low-latency audio applications The MIPI Alliance has recently released the SoundWire I3S (MIPI SWI3S v1.0) specification for high-bandwidth, low-latency audio applications which unify control and data over a single, power-efficient interface. SWI3S builds upon the two-pin, multi-drop architecture of MIPI SoundWire released in 2014, and offers higher bandwidth, low power consumption, much better noise immunity, and support for scalable multi-device topologies to meet the increasing requirements of embedded audio systems. MIPI SWI3S v1.0 supports data rates up to 76 Mbps against 24 Mbps for the earlier SLIMbus and SoundWire audio interfaces, and improves noise immunity by operating in “forwarded clock” or “differential low voltage signaling”. It also implements a range of new features such as Hubs, multiple PHY support, control CRC, power-saving techniques, and more. MIPI SoundWire I3S key features: Transports audio data, control commands, interrupt signals, and synchronization information over a unified two-pin link Forwarded bit clock single-ended (FBCSE) and differential low-voltage [...] The post MIPI SoundWire I3S (SWI3S) targets high-bandwidth, low-latency audio applications appeared first on CNX Software - Embedded Systems News.
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MIPI SoundWire I3S (SWI3S) targets high-bandwidth, low-latency audio applications The MIPI Alliance has recently released the SoundWire I3S (MIPI SWI3S v1.0) specification for high-bandwidth, low-latency audio applications which unify control and data over a single, power-efficient interface. SWI3S builds upon the two-pin, multi-drop architecture of MIPI SoundWire released in 2014, and offers higher bandwidth, low power consumption, much better noise immunity, and support for scalable multi-device topologies to meet the increasing requirements of embedded audio systems. MIPI SWI3S v1.0 supports data rates up to 76 Mbps against 24 Mbps for the earlier SLIMbus and SoundWire audio interfaces, and improves noise immunity by operating in “forwarded clock” or “differential low voltage signaling”. It also implements a range of new features such as Hubs, multiple PHY support, control CRC, power-saving techniques, and more. MIPI SoundWire I3S key features: Transports audio data, control commands, interrupt signals, and synchronization information over a unified two-pin link Forwarded bit clock single-ended (FBCSE) and differential low-voltage [...] The post MIPI SoundWire I3S (SWI3S) targets high-bandwidth, low-latency audio applications appeared first on CNX Software - Embedded Systems News.
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MIPI SoundWire I3S (SWI3S) targets high-bandwidth, low-latency audio applications The MIPI Alliance has recently released the SoundWire I3S (MIPI SWI3S v1.0) specification for high-bandwidth, low-latency audio applications which unify control and data over a single, power-efficient interface. SWI3S builds upon the two-pin, multi-drop architecture of MIPI SoundWire released in 2014, and offers higher bandwidth, low power consumption, much better noise immunity, and support for scalable multi-device topologies to meet the increasing requirements of embedded audio systems. MIPI SWI3S v1.0 supports data rates up to 76 Mbps against 24 Mbps for the earlier SLIMbus and SoundWire audio interfaces, and improves noise immunity by operating in “forwarded clock” or “differential low voltage signaling”. It also implements a range of new features such as Hubs, multiple PHY support, control CRC, power-saving techniques, and more. MIPI SoundWire I3S key features: Transports audio data, control commands, interrupt signals, and synchronization information over a unified two-pin link Forwarded bit clock single-ended (FBCSE) and differential low-voltage [...] The post MIPI SoundWire I3S (SWI3S) targets high-bandwidth, low-latency audio applications appeared first on CNX Software - Embedded Systems News.
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MIPI SoundWire I3S (SWI3S) targets high-bandwidth, low-latency audio applications The MIPI Alliance has recently released the SoundWire I3S (MIPI SWI3S v1.0) specification for high-bandwidth, low-latency audio applications which unify control and data over a single, power-efficient interface. SWI3S builds upon the two-pin, multi-drop architecture of MIPI SoundWire released in 2014, and offers higher bandwidth, low power consumption, much better noise immunity, and support for scalable multi-device topologies to meet the increasing requirements of embedded audio systems. MIPI SWI3S v1.0 supports data rates up to 76 Mbps against 24 Mbps for the earlier SLIMbus and SoundWire audio interfaces, and improves noise immunity by operating in “forwarded clock” or “differential low voltage signaling”. It also implements a range of new features such as Hubs, multiple PHY support, control CRC, power-saving techniques, and more. MIPI SoundWire I3S key features: Transports audio data, control commands, interrupt signals, and synchronization information over a unified two-pin link Forwarded bit clock single-ended (FBCSE) and differential low-voltage [...] The post MIPI SoundWire I3S (SWI3S) targets high-bandwidth, low-latency audio applications appeared first on CNX Software - Embedded Systems News.
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MIPI SoundWire I3S (SWI3S) targets high-bandwidth, low-latency audio applications The MIPI Alliance has recently released the SoundWire I3S (MIPI SWI3S v1.0) specification for high-bandwidth, low-latency audio applications which unify control and data over a single, power-efficient interface. SWI3S builds upon the two-pin, multi-drop architecture of MIPI SoundWire released in 2014, and offers higher bandwidth, low power consumption, much better noise immunity, and support for scalable multi-device topologies to meet the increasing requirements of embedded audio systems. MIPI SWI3S v1.0 supports data rates up to 76 Mbps against 24 Mbps for the earlier SLIMbus and SoundWire audio interfaces, and improves noise immunity by operating in “forwarded clock” or “differential low voltage signaling”. It also implements a range of new features such as Hubs, multiple PHY support, control CRC, power-saving techniques, and more. MIPI SoundWire I3S key features: Transports audio data, control commands, interrupt signals, and synchronization information over a unified two-pin link Forwarded bit clock single-ended (FBCSE) and differential low-voltage [...] The post MIPI SoundWire I3S (SWI3S) targets high-bandwidth, low-latency audio applications appeared first on CNX Software - Embedded Systems News.
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JEDEC公布UFS 5.0規範將完成 傳輸達10.8GB/s滿足AI應用需求 JEDEC 發布 UFS 5.0 標準,將循序存取效能提升至 10.8 GB/s。此標準基於 MIPI M-PHY 6.0,在提升效能與降低功耗的同時,維持與 UFS 4.x 的硬體相容性,以支援新一代 AI 應用。
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JEDEC公布UFS 5.0規範將完成 傳輸達10.8GB/s滿足AI應用需求 JEDEC 發布 UFS 5.0 標準,將循序存取效能提升至 10.8 GB/s。此標準基於 MIPI M-PHY 6.0,在提升效能與降低功耗的同時,維持與 UFS 4.x 的硬體相容性,以支援新一代 AI 應用。
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A minimal Linux driver for the GMAX4002 MIPI camera Will Whang has been using the GMAX4002 MIPI camera with Raspberry Pi 5 and Compute Module 4 via a self developed Linux driver. GMAX4002 requires ...

#cameras #Compute #Module #Raspberry #Pi #5 #GMAX4002 #MIPI

Origin | Interest | Match

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📰 JEDEC Umumkan Standar UFS 5.0 dengan Kecepatan hingga 10.8 GB/s

👉 Baca artikel lengkap di sini: ahmandonk.com/2025/10/07/jedec-ufs-5-0...

#ai #flash #memory #jedec #m-phy #6.0 #mipi #mobile #storage #smartphone #ufs #5.0 #unipro #3.0 #universal #flash #storage

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Original post on kolektiva.social

I'm looking for a CMOS camera sensor for a FOSH project. I'm just looking for a surface mount chip without the lens.

It looks like two big brands are onsemi and omnivision. I'm facing NDA issues, where datasheets are not available, and I'm wondering if there are good options with open specs? […]

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Arasan Launches Pioneering MIPI SWI3S Manager IP and Peripheral Controller Technologies Arasan Chip Systems has made a breakthrough with its launch of the first MIPI SWI3S Manager IP and SWI3S Peripheral IP cores, promising enhanced audio connectivity in mobile devices.

Arasan Launches Pioneering MIPI SWI3S Manager IP and Peripheral Controller Technologies #USA #San_Jose #Arasan #MIPI #SWI3S

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宜鼎於 COMPUTEX 2025 展示異質整合與邊緣 AI 落地解方 * * 全球 AI 解決方案與工業級儲存領導品牌宜鼎國際(Innodisk)迎接成立二十週年,於 COMPUTEX 2025 以「Architect Intelligence」為核心,展出涵蓋記憶體與儲存、相機模組、擴充卡與 AI 平台的多元產品線,並整合打造出地端 LLM 智慧助理、物流包裝辨識、重型機械預警、融合辨別式與生成式 AI 的車輛辨識等完整應用,充分體現宜鼎客製化優勢,以及從元件、異質平台到應用端的整合實力,亦見證宜鼎從工控儲存供應商蛻變為 AI 解決方案夥伴的轉型里程碑。 宜鼎深耕邊緣 AI 多年,不僅將 AI 導入工控領域,更鎖定多元垂直市場的應用,銜接 NVIDIA、Intel、Qualcomm 等國際大廠技術架構,打造支援異質平台的 AI 運算解決方案,展現生態系協作成果。同步看準 AI 視覺的產業應用潛力,宜鼎推出 MIPI、GMSL2、USB 介面相機模組,具高度平台相容性,從樹莓派(Raspberry Pi)、工業電腦到 AI 伺服器皆可靈活整合,全面強化視覺感測於邊緣裝置端的部署效率。因應 AI 衍生的巨量資料處理需求,宜鼎亦投入研發 MRDIMM、CXL 等高頻寬記憶體及 PCIe Gen5 EDSFF SSD,不僅佈局邊緣端,更積極推進企業伺服器與資料中心應用、開創新局。 ### **宜鼎大秀客製化優勢,打造企業地端****LLM****智慧助理、****AI****包裝辨識等垂直市場應用** 宜鼎偕同生態系夥伴及集團子公司安提(Aetina)技術合作,打造 APEX 系列邊緣 AI 運算平台,可針對不同的 AI 算力需求、應用複雜度與垂直場域特性,提供從入門到進階的完整支援。 此次展示的「地端 LLM 智慧助理」,呼應企業對資料自主管理的需求,以高算力的 APEX-X100 邊緣 AI 運算平台,搭載宜鼎自主開發的 AccelBrain LLM(大語言模型)軟體工具,透過易上手的地端 LLM 解決方案為範例,為企業演示如何便捷導入 AI 改善內部流程、提升對外服務與業務拓展。 而另一款展出的「 AI 包裝辨識解決方案」,則採用 APEX-E100 平台,提供執行「辨別式 AI 」所需的基礎算力,讓企業在兼顧效能與合理成本的前提下,將 AI 應用無痛導入至現有作業流程中,實現智慧化升級的第一步。此外,針對在有限空間內需要高階算力的邊緣 AI 伺服器應用,則可透過 2U 短機身設計的 APEX-S100,為邊緣環境提供兼具高效能、高擴充彈性及緊湊尺寸的運算解決方案。 ### **宜鼎相機模組支援各式平台,與研華協力打造重型機械現場的****AI****視覺應用** 電腦視覺相關應用,可謂目前 AI 領域顯學。宜鼎看好作為視覺感測第一線的相機模組,在邊緣裝置端具有極大發展潛力,自主組建完整的相機開發團隊,並延伸出涵蓋 USB、MIPI、GMSL2 等主流規格的嵌入式相機模組陣容。宜鼎相機模組具備廣泛的平台支援性,透過客製 Driver 與轉接板,從廣受開發者歡迎的微型電腦樹莓派、工業電腦、到搭載加速卡的高算力 AI 伺服器,皆可搭配應用。 宜鼎也與研華智能移動與強固邊緣 AI 運算事業處合作,深耕 AI 視覺應用。現場展出針對礦車、建築工程車、農耕機具等垂直市場打造的「智慧重工機具視覺感測解決方案」,以呼應大型機具施作現場對安全性的即時需求。雙方團隊克服技術挑戰,於移動邊緣 AI 平台上整合進多達 16 路的宜鼎 GMSL2 相機,將其安裝在大型重工機具內外;並透過 GMSL2 支援長距離及高速影像傳輸的特點,收集現場影像資料,即時傳送至研華 TREK & REX 邊緣 AI 平台。藉以迅速辨識範圍內的人車異常行為、並提出警示,以爭取足夠反應時間。 ### **攜手國際大廠,打造具高度擴充性的異質****AI****運算平台** 宜鼎亦透過現場 Live demo 展示旗下產品線對多元平台的高度支援性,其中包括與 Qualcomm 合作打造的「車輛 AI 辨識安防解決方案」。該方案採用 Qualcomm Dragonwing™ IQ9 邊緣 AI 運算平台,運用內建 NPU,高效執行融合了 VLM(視覺語言模型)與 GAI(生成式 AI)的多模型運算,可搭配相機擴充模組,即時辨識場域內車輛的製造商、型號與顏色(MMC)、或用於追蹤車輛行蹤;且所有推論皆在邊緣 AI 裝置端完成,無須仰賴雲端,即可實現智慧城市所需的即時決策能力。 宜鼎亦同步展示 Intel® Core™ Ultra Series 2(代號 Arrow Lake-H)全新參考套件(Reference Kit),於平台開發初期即率先整合了宜鼎獨家 MIPI over Type-C 相機模組、CSODIMM 記憶體與 Gen4 SSD 等關鍵零組件,提供無縫整合與高度擴充彈性。面對傳統 MIPI 相機整合的複雜挑戰(如訊號設計、韌體調校、驅動開發等);宜鼎憑藉深厚的技術整合實力,在此參考套件中預先完成 MIPI over Type-C 相機的最佳化支援,大幅降低客戶的開發門檻與整合複雜度。未來客戶採用此套件開發終端產品時,無須在相機整合上投入額外研發資源,即可輕鬆擴展 AI 視覺應用。此完整方案不僅體現宜鼎與 Intel 的深厚技術夥伴關係,更為期望率先導入新一代 Intel 運算平台、搶攻 AI 先機的產業客戶,提供加速產品開發與上市(Time-to-Market)的關鍵途徑。 ### **儲存產品導入次世代規格,推進****AI****伺服器與企業級資料中心市場** 宜鼎的記憶體與儲存產品線具備享譽業界的高度可靠性,亦積極創新、引領業界新標準。本次展出的 PCIe Gen5 SSD 全系列除了 U.2 規格,更推出 EDSFF 標準的 E3.L、E3.S、E1.S 規格,並接軌企業級要求,依循 OCP SSD 2.0 規範開發,象徵宜鼎旗下產品朝企業端、AI 伺服器及資料中心推進。 記憶體方面,宜鼎因應 AI 產生的巨量資料處理需求,推出「AI Memory」前瞻產品。涵蓋業界最新的 LPDDR5 CAMM2、DDR5 8800 MRDIMM,突破傳統頻寬限制、極大化伺服器運算資源的 CXL 記憶體,以及可應用於遠距醫療、自駕車等精密影像辨識的 DDR5 6400 高速大容量記憶體系列。 5 月 20 日至 23 日 COMPUTEX 期間,宜鼎集團將於南港展覽館 1 館 1 樓 – 攤位編號 J0118(J 區入口)展出一系列邊緣 AI 解決方案、智慧儲存與週邊擴充模組,協助全球客戶推動 AI 於產業端落地。 (首圖來源:宜鼎國際 Innodisk;首圖圖說:宜鼎國際以「Architect Intelligence」亮相 COMPUTEX 2025,展現從記憶體、儲存到 AI 應用整合實力,跨足地端 LLM、車輛辨識等智慧解決方案,邁向 AI 夥伴新里程;資料來源:宜鼎國際 Innodisk) 文章看完覺得有幫助,何不給我們一個鼓勵 請我們喝杯咖啡 ## 想請我們喝幾杯咖啡? ### 每杯咖啡 65 元 x 1 x 3 x 5 x 您的咖啡贊助將是讓我們持續走下去的動力 **總金額共新臺幣 0 元** 《關於請喝咖啡的 Q & A》 ### 留給我們的話 取消 確認 從這裡可透過《Google 新聞》追蹤 TechNews * * * 科技新知,時時更新 科技新報粉絲團 加入好友 訂閱免費電子報 * * * 關鍵字: AI , COMPUTEX 2025 , LLM , MIPI , VLM , 宜鼎國際 Innodisk

宜鼎於 COMPUTEX 2025 展示異質整合與邊緣 AI 落地解方 全球 AI 解決方案與工...

technews.tw/2025/05/21/innodisk-comp...

#AI #人工智慧 #市場動態 #AI #COMPUTEX #2025 #LLM #MIPI #VLM #宜鼎國際 #Innodisk

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StickiNote: a sticky notes app for ESP32-P4 and MIPI DSI display Introducing StickiNote – a dig...

blog.adafruit.com/2025/03/21/stickinote-a-...

#displays #ESP32-P4 #microcontrollers #projects #DSI #GUI #MIPI

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StickiNote: a sticky notes app for ESP32-P4 and MIPI DSI display Introducing StickiNote – a dig...

blog.adafruit.com/2025/03/21/stickinote-a-...

#displays #ESP32-P4 #microcontrollers #projects #DSI #GUI #MIPI

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StickiNote: a sticky notes app for ESP32-P4 and MIPI DSI display Introducing StickiNote – a dig...

blog.adafruit.com/2025/03/21/stickinote-a-...

#displays #ESP32-P4 #microcontrollers #projects #DSI #GUI #MIPI

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MIPI CSI-2 v4.0 adds features for always-on, low power machine vision applications - CNX Software MIPI CSI-2 v4.0 adds features for always-on, low power machine vision applications, high-resolution sensors, and HDR automotive image sensors.

The latest #MIPI CSI-2 v4.0 specification adds support for always-on low power machine vision applications using MIPI I3C interface, better compression for high-resolution sensors, and RAW28 pixel encoding for HDR #automotive image sensors. #camera

cnx-software.com/2022/02/09/mip…

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RK628D adds HDMI input, extra video outputs to Rockchip processors - CNX Software Rockchip RK628D video brige chip can enable HDMI input on Rockchip RK3288/RK3399, or add extra video outputs (LVDS, MIPI DSI, RGB...)

.@IloveRockchip RK628D video bridge chip supports #HDMI Tx/Rx, MIPI DSI, RGB, LVDS, #MIPI CSI, GVI video interfaces to add video input or extra video outputs to products based on Rockchip processors such as RK3288 or RK3399.

cnx-software.com/2020/12/21/rk6…

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e-con Systems 13MP MIPI CSI-2 Camera Designed for Nvidia Jetson TK1 Board - CNX Software e-con Systems has just introduced e-CAM130_CUTK1, a 13 MP MIPI CSI-2 camera board specifically designed for Nvidia Jetson TK1 development board powered by

e-con Systems 13MP #MIPI CSI-2 #Camera Designed for @Nvidia Jetson TK1 Board

cnx-software.com/2015/04/23/e-c…

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