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ティアフォーとimecが自動運転革命に向けた共同開発を加速 ティアフォーがimecのAutomotive Chiplet Programに加盟し、自動運転技術の発展を目指した取り組みを開始。新たなチップレットアーキテクチャで次世代の自由な自動運転ソリューションを提供します。

ティアフォーとimecが自動運転革命に向けた共同開発を加速 #自動運転 #ティアフォー #chiplet

ティアフォーがimecのAutomotive Chiplet Programに加盟し、自動運転技術の発展を目指した取り組みを開始。新たなチップレットアーキテクチャで次世代の自由な自動運転ソリューションを提供します。

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ITF 2025: Imec’s Vision for Automotive Over the Long Haul At ITF 2025, imec’s Bart Placklé explained how the research institute is helping to reimagine computing architectures for next-gen vehicles.

www.eetimes.com/imec-vision-...

#IMEC #chiplet #Roadvehicle #invehicle #automotiveEthernet

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Cadence Advances Chiplet Development At CES 2026, Cadence Design Systems, Inc.announced a partner ecosystem to deliver pre-validated chiplet solutions, based on the Cadence physical AI chiplet platform. Initial IP partners include Arm, Arteris, eMemory, M31 Technology, Silicon Creations, and Trilinear Technologies, as well as silicon analytics partner proteanTecs. The new chiplet spec-to-packaged parts ecosystem is expected to reduce engineering complexity and accelerate time to market for developing…

Cadence announces a #chiplet partner ecosystem, paving the way to low-risk advanced chiplet adoption for #physicalAI, #datacenter, and #HPC applications. #CES2026

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Clearly true look into #photonic and #chiplet advances, #Huawei and #GPMI-B, and who has #RVA23 first.

The first #photonicGPU will likely be from China, maybe even #MooreThreads will do it.

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China’s Manhattan Project: The Secret EUV Machine the U.S. Tried to Stop
China’s Manhattan Project: The Secret EUV Machine the U.S. Tried to Stop YouTube video by GVS Deep Dive

#ChipaAndScienceAct catastrophic failure.

#ChinaEUV exists because of it. They also radically improved #DUV and #chiplet integration. And now lead on #photonicAI and #cpo in general plus on #analogNPU
youtu.be/RIbk9UMl_LA

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See #RISC-V #photonicAI #chiplet #GPMI-B for what AI looks like in 2026.

No #nVidia in sight. They have an edge in power draw for now but that should be closed by year's end due to #RVA23 and improved DUV. AMD also had better designs than Intel that rapidly passed it when they got access to fabs.

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Chiplet Technology in Automotive Applications: A Cost-Effective Path to Advanced Electronics Let us emphasize first and foremost the economic case for chiplet architecture in the automotive systems. The automotive industry faces an unprecedented challenge: integrating increasingly sophisticated electronic systems while maintaining cost competitiveness in mass production. Traditional monolithic System-on-Chip (SoC) designs, while functionally robust, present significant economic barriers when scaled to automotive volumes. Chiplet technology emerges as a compelling solution, offering substantial cost advantages through modularity, yield optimization, and design reuse of IP blocks.

#Chiplet Technology in #Automotive Applications: A Cost-Effective Path to Advanced #Electronics

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Intel Wildcat Lake Refresh: CPU entry-level con 4 P-Core
#2027 #AI #Chiplet #Componenti #CoreUltra #CPU #Hardware #Intel #Novità #Processori #TechNews #Tecnologia #WildcatLakeRefresh
www.ceotech.it/intel-wildca...

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Chiplet-Based Solutions, CrowPanel Pico 2.8 Touchscreen, Security Features in Arduino UNO Q: Embedded Week Insights Here’s a RoundUp of this week’s must-read articles – we’ll delve into the latest developments on Chiplet-Based Solutions, CrowPanel Pico 2.8 Touchscreen, and Security Features in Arduino UNO Q! Also, check News Archives – Embedded and Technical Articles Archives – Embedded for the complete list of news and articles from our website. NEWS POLYN Technology Unveils World’s First Silicon-Proven NASP™ Chip, Pioneering a New Era in Ultra-Low-Power Analog AI Processing…

#Chiplet Based Solutions, #CrowPanelPico 2.8 #Touchscreen, #Security Features in #ArduinoUNOQ: #Embedded Week Insights

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Chiplet-Based Solutions Accelerate the Development of Embedded NVM Deca Technologies and Silicon Storage Technology (SST), a subsidiary of Microchip Technology Inc., have announced a strategic collaboration to address the challenges of semiconductor integration through non-volatile memory (NVM) chiplet solutions. This partnership combines Deca's M-Series fan-out and Adaptive Patterning technologies with SST's SuperFlash embedded flash technology, creating what both companies describe as a comprehensive platform for modular, multi-die systems.

Chiplet-based NVM solutions accelerate integration, reducing development time while enhancing flexibility, scalability, and cost efficiency. #microchip #chiplet

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12月5日(金)13:00-17:00に、エレクトロニクス実装学会 #JIEP がシステムインテグレーション(SI)実装技術委員会が3D・チップレット研究会第8回公開研究会『3D・チップレットに関する開発・製造技術動向』を開催。講演5件。京都市下京区・オムロン京都センタービルおよびオンラインにて。詳細は bit.ly/4ni8tfu に。
#Seminar #Chiplet #3D

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📰 Tenstorrent Umumkan Open Chiplet Atlas Ecosystem — Standar Terbuka untuk Masa Depan Desain Silicon Modular

👉 Baca artikel lengkap di sini: ahmandonk.com/2025/10/28/tenstorrent-o...

#ai #hardware #bsc #chiplet #oca #ecosystem #open #chiplet #atlas #open #s

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Arm 加入 OCP 董事會 要制定 AI 資料中心的開放規則 Arm 加入 OCP 董事會,將貢獻小晶片架構,共建 AI 資料中心開放標準,以打造高效、開放的運算生態系,應對功耗與碎片化挑戰。
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Arm 加入 OCP 董事會 要制定 AI 資料中心的開放規則 Arm 加入 OCP 董事會,將貢獻小晶片架構,共建 AI 資料中心開放標準,以打造高效、開放的運算生態系,應對功耗與碎片化挑戰。
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Arm 加入 OCP 董事會 要制定 AI 資料中心的開放規則 Arm 加入 OCP 董事會,將貢獻小晶片架構,共建 AI 資料中心開放標準,以打造高效、開放的運算生態系,應對功耗與碎片化挑戰。
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Arm 加入 OCP 董事會 要制定 AI 資料中心的開放規則 Arm 加入 OCP 董事會,將貢獻小晶片架構,共建 AI 資料中心開放標準,以打造高效、開放的運算生態系,應對功耗與碎片化挑戰。
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Arm加入OCP董事會,要為AI資料中心訂下「開放」的遊戲規則主導下一代AI資料中心的規格制定 在AI發展浪潮中,硬體基礎設施的「標準」之爭日益白熱化。為避免生態系碎片化,開放運算計畫 (Open Comp […]
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Arm加入OCP董事會,要為AI資料中心訂下「開放」的遊戲規則主導下一代AI資料中心的規格制定 在AI發展浪潮中,硬體基礎設施的「標準」之爭日益白熱化。為避免生態系碎片化,開放運算計畫 (Open Comp […]
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Arm加入OCP董事會,要為AI資料中心訂下「開放」的遊戲規則主導下一代AI資料中心的規格制定 在AI發展浪潮中,硬體基礎設施的「標準」之爭日益白熱化。為避免生態系碎片化,開放運算計畫 (Open Comp […]
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📰 Silicon Box Capai 100 Juta Unit Produksi, Buktikan Teknologi Panel-Level Packaging Siap untuk Era AI dan HPC

👉 Baca artikel lengkap di sini: ahmandonk.com/2025/10/17/silicon-box-p...

#ai #chiplet #hpc #panel-level #packaging #semiconductor #silicon #box

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📰 Open Compute Project Perluas Ekosistem “Open Chiplet Economy” untuk Masa Depan AI & HPC

👉 Baca artikel lengkap di sini: ahmandonk.com/2025/10/16/open-chiplet-...

#ai #arm #bow #2.0 #chiplet #eliyan #fcsa #hpc #ocp #open #chiplet #economy

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📰 NVIDIA Gandeng Samsung Foundry untuk Produksi Chip Custom Berbasis NVLink Fusion

👉 Baca artikel lengkap di sini: ahmandonk.com/2025/10/16/nvidia-samsun...

#ai #infrastructure #chiplet #data #center #mgx #nvidia #nvlink #fusion #ocp #samsung #foundry #xpu

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Arm宣布推動開放小晶片生態,重新定義AI基礎設施透過模組化設計推動AI基礎設施創新 在2025年OCP Global Summit活動上,Arm基礎設施業務資深副總裁暨總經理Mohamed Aw […]
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Arm宣布推動開放小晶片生態,重新定義AI基礎設施透過模組化設計推動AI基礎設施創新 在2025年OCP Global Summit活動上,Arm基礎設施業務資深副總裁暨總經理Mohamed Aw […]
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AI×チップレット×光電融合×ガラスサブストレートが拓く次世代半導体パッケージ戦略 part.1 AI×チップレット×光電融合×ガラスサブストレートが拓く次世代半導体パッケージ戦略 part.1 | グローバルネット株式会社はあらゆる半導体関連情報を提供いたします。エッチング/バンプウエハ/CMPなどのウエハ受託加工、世界半導体市場年鑑/世界半導体製造装置市場年鑑を始めとした半導体、有機ELの調査レポートの販売を行っております。

10月22日(水)と11月26日(水)に、グローバルネット㈱がセミナー『AI×チップレット×光電融合×ガラスサブストレートが拓く次世代半導体パッケージ戦略 〜日本メーカーの役割とグローバル競争を勝ち抜く鍵〜』の Part 1 とPart 2 を開催。東京都千代田区・プラザエフにて。Part 1 はオンラインでも開催。Part 2 は懇親会を含む。詳細は bit.ly/4q6LDdB と bit.ly/3KL3Fls に。
#Seminar #AI #Chiplet #CoPackagedOptics #CPO #GlassSubstrate

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10月17日(金)13:00-17:00に、グローバルネット㈱がセミナー『チップレット時代のダイシングとシンギュレーション技術におけるエッジの課題と対策』を開催。講演3件。東京都千代田区・プラザエフにて。 詳細は bit.ly/3Wu0mS6 に。
#Seminar #Chiplet #Dicing #Singulation

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STAMP-2.5D Boosts Thermal and Mechanical Efficiency for Chiplets

STAMP-2.5D Boosts Thermal and Mechanical Efficiency for Chiplets

STAMP-2.5D reduces mechanical stress by 11 % and cuts wirelength by 11 % while only raising peak temperature 0.5 %, per recent simulations. Read more: getnews.me/stamp-2-5d-boosts-therma... #chiplet #thermal

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Lilbits: Intel chips with NVIDIA GPU chiplets and GPD Win 5 performance previews (AMD Strix Halo in a handheld) Intel has made some big investments in GPUs in recent years, and while the company hasn't exactly become a major player in the desktop graphics space, it's made big strides in the performance of the integrated GPUs that are part of Intel's latest mobile chips. But that doesn't mean there's not room for better performance. So it's interesting to see that while Intel plans to continue developing its own iGPUs for the foreseeable future, …

Lilbits: Intel chips with NVIDIA GPU chiplets and GPD Win 5 performance previews (AMD Strix Halo in a handheld) #Chiplet, #Chips, #GpdWin5, #HandheldGamingPcs, #Igpu, #Intel, #Lilbits, #Nvidia, #SteamDeck, #SteamDeckLcd, #StrixHalo, #Zimaos

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Lilbits: Intel chips with NVIDIA GPU chiplets and GPD Win 5 performance previews (AMD Strix Halo in a handheld) Intel has made some big investments in GPUs in recent years, and while the company hasn’t exactly become a major player in the desktop graphics space, it’s made big strides in the performance of the integrated GPUs that are part of Intel’s latest mobile chips. But that doesn’t mean there’s not room for better performance. So […] The post Lilbits: Intel chips with NVIDIA GPU chiplets and GPD Win 5 performance previews (AMD Strix Halo in a handheld) appeared first on Liliputing.
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Deca Technologies and SST Join Forces to Advance Chiplet-Based Non-Volatile Memory Solutions As the complexity and expense of traditional monolithic semiconductor designs continue to escalate, the semiconductor industry is turning increasingly toward chiplet technology as a practical and scalable alternative. In response to this trend, Deca Technologies and Silicon Storage Technology® (SST®), a subsidiary of Microchip Technology Inc., announced today a strategic collaboration aimed at creating a next-generation non-volatile memory (NVM) chiplet package designed to accelerate the adoption of modular, multi-die systems.

Deca Technologies and SST Join Forces to Advance #Chiplet Based #NonVolatileMemory Solutions #NVM

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